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> 기술정보 > LCD Module Laser Bonding
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Process time | |
Process time | |
| -bonding time : 5~10sec | -bonding time : 4~5sec | |||
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Difficult for Keeping hot plate be flatness | |
Easy for keeping be flat of pressure | |
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Difficult for ACF bonding with fine pitch | |
Possible for ACF bonding with | |
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Heat damage | fine pitch | ||
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Small heat damage | |||
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Control temperature rise time | |||
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Low thermal expansion |
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Thermal expansion of FPC in Laser FOG bonding is decreased about 0.3% compared with one of hot plate bonding |
| - due to the decrease of bonding time(7s->3s) and thermal effect by non-contact bonding | |
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Adhesion strength of FPC is increased about 20%(800g/cm->1000g/cm) |
| -improve the bonding reliability of FPC | |
| -reaction rate : about 90~95%(Hot bar 85%) |
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Decrease of pressure by 40% compared with hot bar bonding |
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Better application for slim panel : 0.45t->0.3t |
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12㎛ pitch laser COG bonding result |
| No | Laser bonding | No | Laser bonding | No | Laser bonding | ||||||
| L | C | R | L | C | R | L | C | R | |||
| 1 | -1 | 0 | 1 | 11 | -1 | 0 | 0 | 21 | 0 | 0 | 1 |
| -1 | 0 | 1 | -1 | -1 | 0 | 0 | 1 | 1 | |||
| 2 | -2 | 0 | 0 | 12 | -1 | -1 | 0 | 22 | -2 | 0 | 0 |
| -2 | 0 | 0 | -1 | 0 | 0 | -3 | 0 | 0 | |||
| 3 | -1 | 0 | 0 | 13 | -3 | -2 | -2 | 23 | 0 | -1 | 2 |
| 0 | 0 | 0 | -3 | -2 | -3 | 0 | -1 | 3 | |||
| 4 | -1 | 0 | 0 | 14 | -1 | 0 | 0 | 24 | -2 | 0 | 0 |
| 0 | 0 | 0 | 0 | -1 | 1 | -2 | 0 | 0 | |||
| 5 | -2 | -1 | -1 | 15 | 0 | 0 | 2 | 25 | -3 | -1 | 0 |
| -3 | -1 | -1 | -3 | 0 | 2 | -3 | -1 | 0 | |||
| 6 | -3 | -3 | -3 | 16 | -3 | -1 | 0 | ||||
| -3 | -3 | -2 | 0 | -1 | -1 | ||||||
| 7 | -1 | 0 | 1 | 17 | 0 | 0 | 1 | ||||
| 0 | 0 | 1 | 0 | 0 | 2 | ||||||
| 8 | -2 | -1 | 0 | 18 | 0 | -1 | 2 | ||||
| -2 | -1 | 0 | 0 | -2 | 3 | ||||||
| 9 | -1 | -1 | 0 | 19 | -1 | -1 | 1 | ||||
| -1 | -1 | -1 | -1 | 0 | 1 | ||||||
| 10 | -1 | 0 | 0 | 20 | 0 | 0 | 2 | ||||
| -1 | 0 | 0 | 0 | 0 | 3 | ||||||
