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> 제품소개 > RFID Bonding System > RFID tag Bonder(UPH7000)
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| 개요 | Wafer상태의 RFID Flip Chip 을 ACP를 사용하여 Roll Type Film에 Bonding |
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| Performance | 처리량 | 5,000 UPH 이상 (based on 100% wafer yield, application dependent see UPH map) |
| 가동시간 | >94 % | |
| 산출량 | >98 % (투입 재료 품질에 기인함) | |
| Room class (Recommend) | About 5,000-10,000 (SMT 환경) | |
| Model change method | JIG(SLITTER SPACER) , Program , Pick up tool | |
| Wafer and Die Handling | Wafer size | 6", 8", 12" (mounted on 8" standard frames) |
| Die size | 0.3 mm - 1.2 mm | |
| Die 두께 | 0.1 mm - 0.9 mm | |
| Wafer mapping | (all formats) | |
| Bonding (Pre-Bonding) |
Method | Pick-flip-place |
| 정밀도 | 40μ @ 3Sigma | |
| Bonding delay | Programmable (typical 0 ms) | |
| Alignment method | Fiducial (substrate camera) | |
| Curing System (Final Bonding) |
Bond method | Thermode |
| Bond head | 24 head (standard) | |
| Bonding force | Max 90g | |
| Force resolution | +/- 5%, min | |
| Thermode tip size | 13x13 mm | |
| Coplanarity | +/- 20μ per 1mm | |
| Protective Tape | prevent thermodes from epoxy contamination | |
