기술정보
QUICK 메뉴
greetings
products
technology
home > Techlonogy > LCD Module Laser Bonding
Bonding method
Process time   Process time
  -bonding time : 5~10sec     -bonding time : 4~5sec
Difficult for Keeping hot plate be flatness   Easy for keeping be flat of pressure
Difficult for ACF bonding with fine pitch   Possible for ACF bonding with
Heat damage     fine pitch
    Small heat damage
    Control temperature rise time
    Low thermal expansion
Thermal expansion & peel strength
Thermal expansion of FPC in Laser FOG bonding is decreased about 0.3% compared with one of hot plate bonding
- due to the decrease of bonding time(7s->3s) and thermal effect by non-contact bonding
Adhesion strength of FPC is increased about 20%(800g/cm->1000g/cm)
-improve the bonding reliability of FPC
  -reaction rate : about 90~95%(Hot bar 85%)
Thermal expansion of film &  Adhesion strength
Warpage & reaction rate
Warpage & reaction rate date
Low pressure
COG & FOG
Decrease of pressure by 40% compared with hot bar bonding
Better application for slim panel : 0.45t->0.3t
Fine pstch
12㎛ pitch laser COG bonding result
2㎛ pitch laser COG bonding result
Measurement error : ±1㎛
No Laser bonding No Laser bonding No Laser bonding
L C R L C R L C R
1 -1 0 1 11 -1 0 0 21 0 0 1
-1 0 1 -1 -1 0 0 1 1
2 -2 0 0 12 -1 -1 0 22 -2 0 0
-2 0 0 -1 0 0 -3 0 0
3 -1 0 0 13 -3 -2 -2 23 0 -1 2
0 0 0 -3 -2 -3 0 -1 3
4 -1 0 0 14 -1 0 0 24 -2 0 0
0 0 0 0 -1 1 -2 0 0
5 -2 -1 -1 15 0 0 2 25 -3 -1 0
-3 -1 -1 -3 0 2 -3 -1 0
6 -3 -3 -3 16 -3 -1 0        
-3 -3 -2 0 -1 -1      
7 -1 0 1 17 0 0 1        
0 0 1 0 0 2      
8 -2 -1 0 18 0 -1 2        
-2 -1 0 0 -2 3      
9 -1 -1 0 19 -1 -1 1        
-1 -1 -1 -1 0 1      
10 -1 0 0 20 0 0 2        
-1 0 0 0 0 3      
ACF Connection Technology
Computer / Cellular Phone / PDP-Face
 
copyright(c) astjetec co.ltd.all rights reserver. ASTJETEC Copyright