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Increased design cost and period
Mechanically generated chips
Dimensional error (by Delamination or Scratch)
Increased time and cost - doubled process
Limitation of accuracy at pressing (±0.1mm)
Inappropriate for multi-but-low volume items
카메라모듈조립 사진
Save of cost as mold/pattern is not required
Prompt action to design change or sampling.
Minimized chipping, delamination, scratch or
  burr generation.
Individual compensation for the board shrinkage
  is enabled.
High accuracy is ensured: <50um
금형가공법과 Laser 가공법 비교
Competitive Items Tooling Laser
Product limited types of items multiple items
Speed 2.0sec/stroke 100mm/sec
Actions to deformed outer shape difficult easy
Processed surface rough surface clean surface
Others Tool required - high cost individually processed
LasLaser cutting 결과
0.4T, 5layer 다층 기판 구조 / 0.4T 5layer cutting cross section
 
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