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This system bonds ACF by transferring Carrier mounted

in the housing and bonds (pre/main) housing and FPC
after alignment using a recognition system. Finally it
stocks FPC in the magazine of unloading area.
카메라모듈조립 사진
  adhesive(gh)
N1 3,546
N2 3,974
N3 3,725
Ave. 3,748
TEST 결과
Section Analysis (SEM) : Good
bonding state with pressing
gap of  3~7㎛
1.Impression (Optical microscope) :
Good in terms of conductive ball
breakage.
Bonding force: Good in terms of electrode
deformation. Good bonding force
Curing rate: 96% - good
 
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