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> Technology > Electro Plating System
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High Speed Electro Plating System |
| (Plating Speed: 2~8m/min) | |
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SPH:1,800strips/hr (based on 200mm L/F length) |
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Minimized CPK Control: CPK>1.67 |
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Specially Developed Conveyer Belt for IDF, |
| Shrink type, Full Pak pkg | |
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High Speed Plating is available |
| (L/F gap: 0.6~2mm) | |
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Able to inline High Pressure Water Jet Process |
| inside of Plating System |
| Plating Type | Sn-Cu, Sn-Bi, Sn-Pb, Pure tin, etc |
|---|---|
| Applicable Package | All Descrete(TO series, Fpak IDF pkg, SOT series, Power pkg etc), IC, QFN, DFN, Tantalum Condensor, Auto Motive Device, LED pkg |
| Production Speed | 2~6m/min (6m/min) |
| Dimension | 14,000 x 2,600 x 2,260mm(L x W x H) |
| Loading type | - Auto Slot/Stack magazine to Slot/Stack mgazine system - Mechanical gripper and/or vacuum pickup system - Continuous Belt Conveying System - High Speed Plating System - Pitch Loading System (for IDF, Shrink Type pkgs) |
| Plating Quality | - Belt characteristic:Control 0.6~2mm gap between L/Fs. - CPK >1.67 - Auto Shield System |
| Rectifier | - Constant Current/Constant Voltage control - IGBT Rectifier(Control 20KHz~25KHz, Ripple 1%) - 200A~600A |
| Control Type | - PLC (LS, Omron, Mitsubishi) - Touch Screen - Wireless PC control system |
| Ring Blower | - Jettech standard ring blower |
| Pump Specification (Optional) |
- Designed Pressure: Max. 800 kgf/㎠ - Working Pressure: 600 kgf/㎠ - Water Consumption: Max 15L/min |
| Nozzle(Optional) | Diamond Fan Tip Nozzle |
| Yield | 99.98% |
| MTBA | 2 hours |
| MTBF | 168 hours |
