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Electro Plating System 사진
High Speed Electro Plating System
  (Plating Speed: 2~8m/min)
SPH:1,800strips/hr (based on 200mm L/F length)
Minimized CPK Control: CPK>1.67
Specially Developed Conveyer Belt for IDF,
Shrink type, Full Pak pkg
High Speed Plating is available
(L/F gap: 0.6~2mm)
Able to inline High Pressure Water Jet Process
inside of Plating System
Option : High Pressure W/J Process Inline
Electro Plating System 세부 사진
Plating Type Sn-Cu, Sn-Bi, Sn-Pb, Pure tin, etc
Applicable Package All Descrete(TO series, Fpak IDF pkg, SOT series,
Power pkg etc), IC, QFN, DFN, Tantalum Condensor,
Auto Motive Device, LED pkg
Production Speed 2~6m/min (6m/min)
Dimension 14,000 x 2,600 x 2,260mm(L x W x H)
Loading type - Auto Slot/Stack magazine to Slot/Stack mgazine system
- Mechanical gripper and/or vacuum pickup system
- Continuous Belt Conveying System
- High Speed Plating System
- Pitch Loading System (for IDF, Shrink Type pkgs)
Plating Quality - Belt characteristic:Control 0.6~2mm gap between L/Fs.
- CPK >1.67
- Auto Shield System
Rectifier - Constant Current/Constant Voltage control
- IGBT Rectifier(Control 20KHz~25KHz, Ripple 1%)
- 200A~600A
Control Type - PLC (LS, Omron, Mitsubishi)
- Touch Screen
- Wireless PC control system
Ring Blower - Jettech standard ring blower
Pump Specification
(Optional)
- Designed Pressure: Max. 800 kgf/㎠
- Working Pressure: 600 kgf/㎠
- Water Consumption: Max 15L/min
Nozzle(Optional) Diamond Fan Tip Nozzle
Yield 99.98%
MTBA 2 hours
MTBF 168 hours
자체개발한 특수 이송벨트
Option : High Pressure W/J Process Inline 사진
 
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