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home >Products > RFID Bonding System > RFID tag Bonder(UPH5000)
RFID tag Bonder(UPH5000) Wafer상태의 RFID Flip Chip 을 ACP를 이용하여 Roll Type Tag Film에 Bonding
설비 레이아웃 보기
설비spec
Outline Bonding RFID Flip Chip in wafer form on Roll Type Tag Film
Performance Working Capacity Higher than 5,000 UPH
(based on 100% wafer yield, application dependent see UPH map)
Running time >94 %
Yeild >98 % (depending on material quality)
Room class (Recommend) About 5,000-10,000 (for SMT)
Model change method JIG(SLITTER SPACER) , Program , Pick up tool
Wafer and Die Handling Wafer size 6", 8", 12" (mounted on 8" standard frames)
Die size 0.3 mm - 1.2 mm
Die Thickness 0.1 mm - 0.9 mm
Thermode tip size (all formats)
Bonding
(Pre-Bonding)
Method Pick-flip-place
Accuracy 40μ @ 3Sigma
Bonding delay Programmable (typical 0 ms)
Alignment method Fiducial (substrate camera)
Curing System
(Final Bonding)
Bond method Thermode
Bond head 24 head (standard)
Bonding force Max 90g
Force resolution +/- 5%, min
Thermode tip size 13x13 mm
Coplanarity +/- 20μ per 1mm
Protective Tape prevent thermodes from epoxy contamination
 
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