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home > Products > LED Packing > Encapsilation Dispenser
Encapsilation Dispenser - Die 및 Wier Bonding완료된 리드프레임 Cavity에 형광액을 정량 도포하여 Die 및 Wier를 보호하고 빛의 균일한 발광에 기여하는 공정
설비 레이아웃 보기
설비spec
Outline Protecting Die and Wire and helping even light radiation by coating fluorescent liquid on the lead frame cavity completed with die and wire bonding
Application 8-row Top view LED
Tact time UPH : 18,000EA/hr (jet valve)
Cycle time : 0.2sec/chip
Dispensing position
Accuracy
±30㎛
Min valve closing time 0.1msec
Max jetting frequency 150cyle/sec
Maintence interval ball/seat 100milion cycle
Pattern
Recognition
system
System 256 Gray Scale (Pattern matching)
Position accuracy X,Y: ±1/4 Pixel, Θ:±0.05˚
Resolution 640*480 Pixel
Equipment Size 850*1200*1600
 
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