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home > Products > LED Packing > LED Die Bonder
LED Die Bonder - Loader에 적재된 L/F 1장이 분리되어 Feeder에 공급되면 Vision System 에의한 Align작업 후 L/F Bed면에 Epoxy를 Dotting하고, Wafer상태의 Chip을 Vision System의 인식정보를 이용하여 양품 Chip을 Wafer로부터  분리시켜 Epoxy가 Dotting된 L/F Bed면에 Bonding하고, Inspection후 Unloader의 Magazine에 수납
설비 레이아웃 보기
설비spec
Outline When one L/F stacked in the loader is separated and fed to the feeder epoxy is dotted on L/F bed after vision-activated alignement. the system separate chips in good condition from wafter using a chip recognition information of the vision system and bonds them on epoxy dotted LF bed. Finally the system inspects and places them in unloader magazine.
Cycle Time UPH : Over 18K
Cycle Time : 0.2sec
(* UPH can be varied according to Chip Size(length, thickness), condition,
L/F conditions)
Bonding Accuracy ±25㎛, θ : ±3°
( For Epoxy Die Bonder )
Bonding Method Main : Ag Epoxy, DAF(For WBL)
Epoxy Viscosity : 6,100~22,000 cps, Film laminating
Utility Power : AC220V, 1Φ, 60Hz
Air : 4~6kg/㎠
Vacuum : 400mmHg
Production Yield 99.50%
Operation Rate 90%
Equipment Size 1780*1300*1940
 
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