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home > Products > LCD Module > Si - dispenser
Si- dispenser - 본 SYSTEM은 PANEL/PCB Bonding 작업 후 TFT-LCD의 SOURCE 1변의 상부/배면 도포작업을 하여 UNLOADER의 TRAY에 적재하는 SYSTEM으로 CELL 물류부, VISION부, 상부도포부, 배면 도포부로 구성됨.
설비 레이아웃 보기
설비spec
Outline The system stacks panel and PCB on the tray of unloader after coating 1 side
of TFT-LCD source for top/bottom followed by panel/PCB bonding.
Application 8"~15.4"
Tact time 15 SEC (MAX :15.4", Coating both Top and Bottom)
9 SEC (MIN :8~MAX :10.4", 2CELL, Coating both Top and Bottom)
>Based on SOURCE line
Operation Efficiency 99.9 %, ((Actual running hours of A room - stoppage hour)/
Actual running hour)×100
Panel
Spec
Panel Size MAX :W 360mm*D251mm(15.4")
MIN: W 163mm * D 97mm(8")
(For TFT CUTTING LINE)
PCB lead pitch 200㎛
Panel Thickness 0.2t, 0.3t, 0.5t ,0.63t× 2
Utility Power 208V±10%(3-Phase)
Air, Vacuum Constant pressure 5~7kgf/㎠
Equipment Size 1620*1300*1600
 
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