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COG(1”~7”) - Conveyor에 공급된 Panel을 Loading 하여 Pre-align 후 단자세정, ACF가압착,CHIP가압착, 본압착(HOT BAR)공정으로 구성된 COG Bonder
설비 레이아웃 보기
설비spec
Outline This COG Bonder is composed of processing including washing the terminal after loading and pre aligning the panel fed to conveyor, ACF pressing, Chip pre bonding and main bonding (hot bar).
Application 1"~ 7"
Tact time 3.5sec / 1Panel
-1chip/panel
- ACF bonding time : less than 1s
- Pre bonding time : less than 0.3s
- Final bonding time : less than 8s
- Tray change time is included when stacking Panel 30ea/1Tray
- Panel length shorter than 85mm (Using Final bonder 4head)
Bonding
Accuracy
ACF X : ± 0.3mm
Y : ± 0.15mm
Pre X : ± 3㎛
Y : ± 3㎛
Final X : ± 4㎛
Y : ± 4㎛
Operation efficiency OP rate : 99.8% Error: 0.2%
Panel
Spec
Size 1"~7"
Lead pitch Minimum 14㎛
Thickness 0.3mm~2.6mm
Mountable Line No Section
Utility Power 3-phase 220V 50/60Hz
Air, Vacuum Air : 0.5~0.8Mpa 450L/min Hose 10ø
Vaccum : -80Kpa or low 450L/min
 
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