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COG(7”~15.6”) - Conveyor 에 공급된 Panel을 Loading 하여 Pre-align후 단자세정, ACF가압착,CHIP가압착, 본압착(Hot bar) 공정으로 구성된 COG Bonder.
설비 레이아웃 보기
설비spec
Outline This COG Bonder is composed of processing including washing the terminal after loading and pre aligning the panel fed to conveyor, ACF pressing, Chip pre bonding and main bonding (hot bar).
Application 7"~15.6"
Tact time 12 sec (7" : 3 Source + 1 Gate)
- ACF Bonding Time : 2.0sec
- Prebonding Time : 0.2sec/TAB
- Mainbonding Time : 5.0sec
Bonding
Accuracy
ACF X : ±1.0㎜ (3σ)
Y : ±0.2㎜ (3σ)
Pre X : ±2㎛ (3σ)
Y : ±2㎛ (3σ)
θ : 0.03° (3σ)
Main X : ±3㎛ (After main bonding_3σ)
Y : ±5㎛ (After main bonding_3σ)
Operation efficiency 98% (M/C STOP Zero)
Panel
Spec
Panel Size 7" ∼ 15.6"(TFT : 161.45 X 97.76)
Panel lead pitch SOURCE : 57um, GATE : 44um
Panel Thickness 0.25t, 0.3t, 0.5t ,0.63t× 2
Mountable Line No 2 max. (Xu) ,(Yl)
Utility Power 208V±10%(3-Phase)
Air, Vacuum 1/2 Inch Fitting
: Over 5kgf/㎠ constant pressure
: -75KPa or higher macuum power
Equipment Size 6470*22708*1870
 
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