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home > Products > LCD Module > PCB Bonder(MiniPc)
PCB Bonder(MiniPC) - 본 SYSTEM은 OLB작업 후 TFT-LCD의 SOURCE부 TAB-IC에 ACF를 이용하여 각각의 PCB를 압착하는IN-LINE SYSTEM으로 CELL물류부, PCB BONDING부, TRAY FEEDER로 구성됨.
설비 레이아웃 보기
설비spec
Outline This inline system using ACF to bond PCBs on TFT-LCD source TAB-IC after OLB works is composed of CELL distributor, PCB Bonder and Tray Feeder.
Application 7"~17"W
Tact time 9 SEC/PANEL (PCB 1EA) [S]
-ACF Bonding TIME : 1.5 SEC
-Main Bonding TIME : 5.0 SEC
Bonding
Accuracy
ACF X : ±0.2㎜
Y : ±0.1㎜
Main bonding X : ±30㎛ (After main bonding_3σ)
Y : ±50㎛ (After main bonding_3σ)
Operation Efficiency (Pause+Failure) Lower than 1.5% (Material related causes excluded)
Panel
Spec
Panel Size 7" ∼ 17"(for TFT CUTTING LINE)
Panel lead pitch SOURCE : 57um, GATE : 44um
Panel Thickness 0.2t, 0.3t, 0.5t ,0.63t× 2
Mountable line quantity 1 max. (Xu)
Utility Power 208V±10%(3-Phase)
Air, Vacuum 1/2 Inch Fitting
: Over 5kgf/㎠ constant pressure
: -75KPa or higher vacuum power
Equipment Size TRAY FEEDER 2UNIT : 1900*1000*1725 =>2000KG (2UNIT)
PCB ACF BONDER 2UNIT : 2630*1295*1620 =>4500KG(2UNIT)
PCB MAIN BONDER 1UNIT : 800*1340*1620 =>6000KG (1UNIT)
 
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