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PCB Bonder(CD군) - MODULE 공정에서 Panel 구동 PCB Bonding System 으로 SOURCE부 TAB-IC에 ACF를 이용하여 각각의 PCB를 압착하는 IN-LINE SYSTEM으로 PANEL 물류부, PCB BONDING부, TRAY FEEDER 등으로 구성됨.
설비 레이아웃 보기
설비spec
Outline This in-line PCB bonding system bonds PCBs on Source TAB-IC in the Module process is composed of Panel distributor, PCB Bonder and Tray Feeder.
Application 32"~60"W
Tact time 15 SEC
-ACF Bonding TIME : 2.0 SEC
-Main Bonding TIME : 6.0 SEC
Accuracy ACF Pre-bonding X : ±0.2㎜(3σ)
Y : ±0.2㎜ (3σ)
Main bonding X : ±30㎛ (After the main bonding_3σ)
Y : ±50㎛ (After the main bonding_3σ)
Operation Efficiency 98% (M/C STOP ZERO)
Panel
Spec
Panel Size MAX 1355mm*770mm ,MIN 713mm*411mm
Lead pitch Min. 200㎛
Tap IC Size L (Length, X-direction) : 28~63.3mm
W(Width, X-direction) :19.2~44.5mm
Panel Thickness 0.2t, 0.3t, 0.5t ,0.63t× 2
Utility Power 208V±10%(3-Phase)
Air, Vacuum 1/2 Inch Fitting
: Over 5kgf/㎠ constant pressure.
: -75KPa or higher vacuum power
Equipment Size 4900×4090×1900 (L × W × H)
 
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